PI’s latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications.
(Nanowerk News) PI (Physik Instrumente) announced the release of the F-713, the latest upgrade to its highly regarded F-712, 6-axis alignment system for photonics chips, fiber arrays, and wafers. The new model retains the F-712’s high-performance hybrid mechanical design based on a hexapod/piezo-scanner combination. It also incorporates a more powerful and flexible controller designed to support future developments in photonics alignment technology.
Enhanced Controller for Increased Flexibility
- Improved support for future software and hardware developments
- Streamlined integration of third-party electronics
- More flexible configuration options for alignment routines and integration with new systems
- Better scalability as customer requirements evolve
F-713: A Seamless Transition from the F-712
For current users of the F-712, the F-713 offers a smooth upgrade path. The system’s mechanical design, software interface, and motion control architecture remain consistent, ensuring that users can continue to rely on their existing workflows. The addition of the more flexible controller makes the F-713 a practical option for those looking to future-proof their photonics alignment systems without significant changes to their current setup.
Availability
The new F-713 High-Speed 6-DOF Photonics Alignment System is now available for integration into existing systems or for new applications requiring flexible, reliable alignment capabilities.
